ASMPT's ultra-high precision flip chip bonder 'NANO Pro'
Achieved alignment accuracy of ±0.2μm. Extensive track record of implementation, primarily in optical communication and silicon photonics.
The "NANO Pro" is a bonding device that uses ASMPT's patented alignment technology to bond diced chips to wafers, substrates, and chips with ultra-high precision of ±0.2μm. It employs laser bonding, achieving localized heating and a high-speed temperature profile during the bonding process. It also features mechanisms to suppress vibrations during bonding and from external sources. 【Main Specifications】 ■ Alignment Accuracy: ±0.2μm@3σ ■ Cycle Time: 18 seconds (varies by material) ■ Die Size: 0.1mm to 25mm ■ Substrate Size: MAX 300×300mm ■ Bonding Force (Load): 3g up to 2000g ■ Bonding Methods: Eutectic solder, epoxy, UV-curable resin, laser bonding 【Adoption Results】 ■ Optical communication ■ Silicon photonics ■ R&D and mass production facilities ■ MEMS sensors, LiDAR, VCSELs, etc. *For more details, please feel free to contact us.
- Company：兼松ＰＷＳ
- Price：Other
